
Scott Roy, University of Glasgow, Scotland
S. Deleonibus, CEA-LETI, Grenoble, France
K. De Meyer, IMEC, Leuven, Belgium
M. Haond, ST Microelectronics, Crolles, France
Y. Ponomarev, NXP, Netherlands
E. Sangiorgi, ARCES-DEIS, University of Bologna, Italy
L. Risch, Qimonda, Dresden, Germany
F. Balestra, IMEP Minatec, Grenoble, France
N. Collaert, IMEC, Leuven, Belgium
G. Doornbos, TSMC, Leuven, Belgium
T. Ernst, CEA LETI, Grenoble, France
C. Fiegna, ARCES-DEIS, University of Bologna, Italy
G. Ghibaudo, IMEP Minatec, Grenoble, France
J. Hoentschel, Global Foundries
M. Lemme, Harvard University, Cambridge, MA, USA
S. Mantl, Juelich
S. Monfray, ST Microelectronics
S. Roy, University of Glasgow, Scotland
L. Selmi, University of Udine, Italy
Karol Kalna
Campbell Millar
Andrew Brown